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LBP01-0803SC5 数据表(PDF) 4 Page - STMicroelectronics |
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LBP01-0803SC5 数据表(HTML) 4 Page - STMicroelectronics |
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4 / 8 page ![]() Package information LBP01 4/8 Doc ID 022950 Rev 1 3 Package information ● Epoxy meets UL94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 3. SMB dimensions Ref. Dimensions Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 L 0.75 1.50 0.030 0.059 Figure 5. Footprint, dimensions in mm (inches) Figure 6. Marking(1) 1. Product marking may be rotated by 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. E C L E1 D A1 A2 b 2.60 5.84 1.62 2.18 1.62 (0.064) (0.102) (0.23) (0.064) (0.086) y w w z x x x ECOPACK compliance XXX: Marking Z: Manufacturing location Y: Year WW: week |
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