X T

V 2

X = 1 Digit Date Code

T = Die Traceability

V2 = Product Identification

= Pin A1

ENB

VIN

GND

D2B

ISET

D1B

A

B

C

2

1

ENA

D1A

D2A

3

ENB

VIN

GND

D2B

ISET

D1B

A

B

C

2

1

ENA

D1A

D2A

3

LP5524

SNVS500 – JULY 2007

www.ti.com

Micro SMD-9 package, 1.215 x 1.215 x 0.60 mm body size, 0.4 mm pitch

Figure 1. Top View

Figure 2. Bottom View

PACKAGE MARK

ORDERING INFORMATION

Order Number

Default LED

Package Marking

Supplied As

Spec/Flow

LP5524TM-5

5 mA

V2

TNR 250

NOPB

LP5524TMX-5

5 mA

V2

TNR 3000

NOPB

(1)

Other current options are available upon request, please contact the National Semiconductor Sales Office.

PIN DESCRIPTIONS

Pin

Name

Type

Description

A1

ISET

AI

Current set input

A2

ENB

DI

Enable for bank B

A3

ENA

DI

Enable for bank A

B1

D1B

AO

Current source output, bank B LED1

B2

VIN

P

Power supply pin

B3

D1A

AO

Current source output, bank A LED1

C1

D2B

AO

Current source output, bank B LED2

C2

GND

G

Ground

C3

D2A

AO

Current source output, bank A LED2

2

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Product Folder Links: LP5524