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SP0504SHTG 数据表(PDF) 3 Page - Littelfuse |
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SP0504SHTG 数据表(HTML) 3 Page - Littelfuse |
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3 / 5 page ![]() 3 ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. TVS Diode Arrays (SPA™Family of Products) Revision: August 13, 2012 SP0504S Series Low Capacitance ESD Protection - SP0504S Series Capacitance vs. Frequency 0 2E-13 4E-13 6E-13 8E-13 1E-12 1.2E-12 1.4E-12 1.6E-12 1.8E-12 2E-12 1.E+06 1.E+07 1.E+08 1.E+09 Frequency [Hz] Time TP TL TS(max) TS(min) 25 tP tL tS time to peak temperature Preheat Preheat Ramp-up Ramp-up Ramp-down Ramp-do Critical Zone TL to TP Critical Zone TL to TP Reflow Condition Pb – Free assembly Pre Heat -Temperature Min (T s(min)) 150°C -Temperature Max (T s(max)) 200°C -Time (min to max) (t s) 60 – 180 secs Average ramp up rate (Liquidus) Temp (T L) to peak 3°C/second max T S(max) to TL - Ramp-up Rate 3°C/second max Reflow -Temperature (T L) (Liquidus) 217°C -Temperature (t L) 60 – 150 seconds PeakTemperature (T P) 260+0/-5 °C Time within 5°C of actual peak Temperature (t p) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peakTemperature (T P) 8 minutes Max. Do not exceed 260°C Soldering Parameters Product Characteristics Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Ordering Information Part Number Package Marking Min. Order Qty. SP0504SHTG SOT23-6 E*4 3000 Part Numbering System Part Marking System SP0504S TG Series Package H= SOT23-6 T= Tape & Reel G= Green Silicon Protection Array (SPATM) Family of TVS Diode Arrays H E*4 E * 4 Product Series E = SP0504S series Assembly Site (varies) Number of Channels |
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