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LM397MFNOPB 数据表(PDF) 2 Page - Texas Instruments |
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LM397MFNOPB 数据表(HTML) 2 Page - Texas Instruments |
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2 / 15 page ![]() LM397 SNOS977D – MAY 2001 – REVISED MARCH 2013 www.ti.com Absolute Maximum Ratings (1) (2) ESD Tolerance(3) Human Body Model 2KV Machine Model 200V VIN Differential 30V Supply Voltages 30V or ±15V Voltage at Input Pins −0.3V to 30V Storage Temperature Range −65°C to +150°C Junction Temperature(4) +150°C Soldering Information Infrared or Convection (20 sec.) 235°C Wave Soldering (10 sec.) 260°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. (2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications. (3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC). (4) The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) - TA)/ θJA . All numbers apply for packages soldered directly onto a PC board. Operating Ratings (1) Supply Voltage, VS 5V to 30V Temperature Range(2) −40°C to +85°C Package Thermal Resistance(2) 5-Pin SOT-23 168°C/W (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. (2) The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) - TA)/ θJA . All numbers apply for packages soldered directly onto a PC board. 2 Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LM397 |
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