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B40C800DM 数据表(PDF) 1 Page - General Semiconductor |
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B40C800DM 数据表(HTML) 1 Page - General Semiconductor |
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1 / 2 page  B40C800DM THRU B380C800DM MINIATURE GLASS PASSIVATED SINGLE-PHASE BRIDGE RECTIFIER Reverse Voltage - 65 to 600 Volts Forward Current - 0.9 Ampere FEATURES ♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0 ♦ Glass passivated chip junctions ♦ Surge overload rating of 45 Amperes peak ♦ Ideal for printed circuit boards ♦ High temperature soldering guaranteed: 260°C/10 seconds at 5 lbs. (2.3kg) tension MECHANICAL DATA Case: Molded plastic body over passivated junctions Terminals: Plated leads solderable per MIL-STD-750, Method 2026 Polarity: Polarity symbols marked on body Mounting Position: Any Weight: 0.04 ounce, 1.0 gram MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. B40 B80 B125 B250 B380 SYMBOLS C800DM C800DM C800DM C800DM C800DM UNITS Maximum repetitive peak reverse voltage VRRM 65 125 200 400 600 Volts Maximum RMS input voltage R + C-load VRMS 40 80 125 250 380 Volts Maximum average forward output current for free air operation at TA=45°C R + L-load I(AV) 0.9 Amp C-load 0.8 Maximum DC blocking voltage VDC 65 125 200 400 600 Volts Maximum peak working voltage VRWM 90 180 300 600 900 Volts Maximum non-repetitive peak voltage VRSM 100 200 350 650 1000 Volts Maximum repetitive peak forward surge current IFRM 10.0 Amps Peak forward surge current single sine wave on rated load at TJ=125°C IFSM 45.0 Amps Rating for fusing at TJ=125°C (t<100ms) I2t 10.0 A2sec Minimum series resistor C-load at VRMS = ±10% RT 1.0 2.0 4.0 8.0 12.0 Ohms Maximum load capacitance +50% -10% CL 5000 2500 1000 500 200 µF Maximum instantaneous forward voltage drop per leg at 0.9A VF 1.0 Volts Maximum reverse current at rated repetitive peak voltage per leg IR 10.0 µA Typical thermal resistance per leg (NOTE 1) R ΘJA 40.0 R ΘJL 15.0 °C/W Operating junction temperature range TJ -40 to +125 °C Storage temperature range TSTG -40 to +150 °C NOTES: (1) Thermal resistance from junction to ambient and from junction to lead P.C.B. mounted on 0.5 x 0.5" (13 x 13mm) copper pads Case Style DFM Dimensions in inches and (millimeters) 0.315 (8.00) 0.285 (7.24) 0.013 (3.3) 0.0086 (0.22) 0.350 (8.9) 0.300 (7.6) 0.255 (6.5) 0.245 (6.2) 0.335 (8.51) 0.320 (8.12) 0.045 (1.14) 0.035 (0.89) 0.080 (2.03) 0.050 (1.27) 0.023 (0.58) 0.018 (0.46) 0.185 (4.69) 0.150 (3.81) 0.130 (3.3) 0.120 (3.05) 0.075 (1.90) 0.055 (1.39) 0.205 (5.2) 0.195 (5.0) 4/98 |
类似零件编号 - B40C800DM |
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类似说明 - B40C800DM |
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