FEP30AP datasheet(1/2 Pages) GE

部件名	FEP30AP

功能描述	FAST EFFICIENT PLASTIC RECTIFIER

PDF	2 Pages

Scroll/Zoom	100%

制造商	GE [General Semiconductor]

网页	http://www.vishay.com

标志

1 / 2 page

4/98

FEP30AP THRU FEP30JP

FAST EFFICIENT PLASTIC RECTIFIER

Reverse Voltage - 50 to 600 Volts

Forward Current - 30.0 Amperes

FEATURES

♦ Plastic package has Underwriters Laboratory

Flammability Classification 94V-0

♦ Dual rectifier construction, positive center-tap

♦ Glass passivated chip junctions

♦ Superfast recovery times for high efficiency

♦ Low forward voltage,

high current capability

♦ Low thermal resistance

♦ Low power loss

♦ High temperature soldering guaranteed:

250°C, 0.16” (4.06mm) from case for 10 seconds

MECHANICAL DATA

Case: JEDEC TO-247AD molded plastic body over

passivated chips

Terminals: Plated leads solderable per MIL-STD-750,

Method 2026

Polarity: As marked

Mounting Position: Any

Mounting Torque: 10 in. - lbs. max.

Weight: 0.22 ounce, 6.3 grams

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Ratings at 25°C ambient temperature unless otherwise specified.

FEP

SYMBOLS

30AP

30BP

30CP

30DP

30FP

30GP

30HP

30JP

UNITS

Maximum repetitive peak reverse voltage

VRRM

50

100

150

200

300

400

500

600

Volts

Maximum RMS voltage

VRMS

35

70

105

140

210

280

350

420

Volts

Maximum DC blocking voltage

VDC

50

100

150

200

300

400

500

600

Volts

Maximum average forward rectified current

at TC=100°C

I(AV)

30.0

Amps

Peak forward surge current

8.3ms single half sine-wave superimposed

IFSM

300.0

Amps

on rated load (JEDEC Method) at TC=100°C

Maximum instantaneous forward voltage per leg

at 15.0A

VF

0.95

1.3

1.5

Volts

Maximum DC reverse current

TC=25°C

10.0

at rated DC blocking voltage

TC=100°C

IR

500.0

µA

Maximum reverse recovery time time (NOTE 1)

per leg

trr

35.0

50.0

ns

Typical junction capacitance per leg (NOTE 2)

CJ

175.0

145.0

pF

Typical thermal resistance (NOTE 3)R

ΘJC

1.0

°C/W

Operating storage and temperature range

TJ, TSTG

-55 to +150

°C

NOTES:

1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A

(2) Measured at 1.0 MHZ and applied reverse voltage of 4.0 Volts

(3) Thermal resistance from junction to case per leg mounted on heatsink

PIN 1

PIN 3

CASE

0.245 (6.2)

0.225 (5.7)

0.645 (16.4)

0.625 (15.9)

0.323 (8.2)

0.313 (7.9)

0.142 (3.6)

0.138 (3.5)

0.170

(4.3)

0.086 (2.18)

0.076 (1.93)

0.160 (4.1)

0.140 (3.5)

0.225 (5.7)

0.205 (5.2)

0.127 (3.22)

0.117 (2.97)

0.048 (1.22)

0.044 (1.12)

0.795 (20.2)

0.775 (19.6)

0.840 (21.3)

0.820 (20.8)

1

2

3

0.078 REF

(1.98)

0.203 (5.16)

0.193 (4.90)

10

o TYP.

BOTH SIDES

30o

10

o

1

o

REF.

0.118 (3.0)

0.108 (2.7)

0.030 (0.76)

0.020 (0.51)

BOTH SIDES

PIN 2

TO-247AD

Dimensions in inches and (millimeters)

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