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GP02-35 数据表(PDF) 1 Page - General Semiconductor |
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GP02-35 数据表(HTML) 1 Page - General Semiconductor |
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1 / 2 page ![]() GP02-20 THRU GP02-40 HIGH VOLTAGE GLASS PASSIVATED JUNCTION RECTIFIER Reverse Voltage - 2000 to 4000 Volts Forward Current - 0.25 Ampere FEATURES ♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0 ♦ High temperature metallurgically bonded construction ♦ Glass passivated cavity-free junctions ♦ Capable of meeting environmental standards of MIL-S-19500 ♦ High temperature soldering guaranteed: 350°C/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension MECHANICAL DATA Case: JEDEC DO-204AL molded plastic over glass body Terminals: Plated axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.012 ounce, 0.3 gram MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. GP02 GP02 GP02 GP02 GP02 SYMBOLS -20 -25 -30 -35 -40 UNITS Maximum repetitive peak reverse voltage VRRM 2000 2500 3000 3500 4000 Volts Maximum RMS Voltage VRMS 1400 1750 2100 2450 2800 Volts Maximum DC blocking voltage VDC 2000 2500 3000 3500 4000 Volts Maximum average forward rectified current 0.375" (9.5mm) lead length at TA=55°C I(AV) 0.25 Amp Peak forward surge current 8.3ms single half sine-wave superimposed on rated load at: IFSM 15.0 Amps (JEDEC Method) TA=55°C Maximum instantaneous forward voltage at 1.0A VF 3.0 Volts Maximum DC reverse current TA= 25°C 5.0 at rated DC blocking voltage TA=100°C IR 50.0 µA Typical reverse recovery time (NOTE 1) trr 2.0 µs Typical junction capacitance (NOTE 2) CJ 3.0 pF Typical thermal resistance (NOTE 3) R ΘJA 130.0 °C/W Operating junction and storage temperature range TJ, TSTG -65 to +175 °C NOTES: (1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A (2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts (3) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead lengths, P.C.B. mounted 4/98 0.107 (2.7) 0.080 (2.0) 0.034 (0.86) 0.028 (0.71) DIA. 1.0 (25.4) MIN. 1.0 (25.4) MIN. 0.205 (5.2) 0.160 (4.1) DIA. DO-204AL Dimensions in inches and (millimeters) *Glass-plastic encapsulation technique is covered by Patent No. 3,996,602 and brazed-lead assembly by Patent No. 3,930,306 ® |
类似零件编号 - GP02-35 |
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类似说明 - GP02-35 |
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