MB2M datasheet(1/2 Pages) GE

部件名	MB2M

功能描述	MINIATURE GLASS PASSIVATED SINGLE-PHASE BRIDGE RECTIFIER

PDF	2 Pages

Scroll/Zoom	100%

制造商	GE [General Semiconductor]

网页	http://www.vishay.com

标志

1 / 2 page

MB2M THRU MB6M

MINIATURE GLASS PASSIVATED SINGLE-PHASE BRIDGE RECTIFIER

Reverse Voltage - 200 to 600 Volts

Forward Current - 0.5 Ampere

FEATURES

♦ Plastic package has Underwriters Laboratory Flammability

Classification 94V-0

♦ This series is UL recognized under Component Index,

file number E54214

♦ Glass passivated chip junctions

♦ High surge overload rating: 35A peak

♦ Saves space on printed circuit board

♦ High temperature soldering guaranteed:

260°C/10 seconds, at 5 lbs. (2.3kg) tension

MECHANICAL DATA

Case: Molded plastic body over passivated junctions

Terminals: Plated leads solderable per MIL-STD-750,

Method 2026

Polarity: Polarity symbols marked on body

Mounting Position: Any

Weight: 0.078 ounce, 0.22 gram

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Ratings at 25°C ambient temperature unless otherwise specified.

SYMBOLS

MB2M

MB4M

MB6M

UNITS

Device marking code

2

4

6

Maximum repetitive peak reverse voltage

VRRM

200

400

600

Volts

Maximum RMS voltage

VRMS

140

280

420

Volts

Maximum DC blocking voltage

VDC

200

400

600

Volts

Maximum average forward output rectified

current at TA=30°C - on glass-epoxy P.C.B. (NOTE 1)

I(AV)

0.5

Amp

on aluminum substrate (NOTE 2)

0.8

Peak forward surge current 8.3msec. single half sine-

wave superimposed on rated load (JEDEC Method)

IFSM

35.0

Amps

Rating for fusing (t<8.3ms)

I2t

5.0

A

2sec

Maximum instantaneous forward voltage drop

per leg at 0.4A

VF

1.0

Volts

Maximum DC reverse current at

TA=25°C

5.0

µA

rated DC blocking voltage per leg

TA=125°C

IR

500

Typical junction capacitance per leg (NOTE 3)

CJ

13.0

pF

Typical thermal resistance per leg

(NOTE 1)

R

ΘJL

20.0

(NOTE 1)

R

ΘJA

85.0

°C/W

(NOTE 2)

R

ΘJA

70.0

Operating junction and storage temperature range

TJ, TSTG

-55 to +150

°C

NOTES:

(1) On glass epoxy P.C.B. mounted on 0.05 x 0.05” (1.3 x 1.3mm) solder pads

(2) On aluminum substrate P.C.B. with an area of 0.8 x 0.8 x 0.25” (20 x 20 x 6.4mm) mounted

on 0.05 x 0.05” (1.3 x1.3mm) solder pad

(3) Measured at 1.0 MHZ and applied reverse voltage of 4.0 Volts

0.147 (3.73)

0.137 (3.48)

0.144 (3.65)

0.161 (4.10)

0.106 (2.70)

0.090 (2.30)

0.190 (4.83)

0.179 (4.55)

0.029 (0.74)

0.017 (0.43)

0.012 (0.30)

0.008 (0.20)

0.105 (2.67)

0.095 (2.41)

0.047 (1.19)

0.038 (0.96)

0.205 (5.21)

0.195 (4.95)

0-10

°

0.117 (2.97)

0.107 (2.72)

0.028 (0.71)

0.020 (0.51)

0.016(0.41)

0.006 (0.15)

0.100 (2.54)

MIN.

0.049 (1.24)

0.039 (0.99)

Case Style MBM

Dimensions in inches and (millimeters)

PATENT PENDING

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