MAX20070 datasheet(2/34 Pages) MAXIM

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BATT to GND ........................................................-0.3V to +52V

OUT_, DRAIN, OVP to GND.................................-0.3V to +52V

IN, INN, VCC, FLT, DIM, CS, EN to GND ...............-0.3V to +6V

COMP, ISET to GND................................ -0.3V to (VCC + 0.3V)

DRAIN and CS Continuous Current.....................................2.4A

FBPG, FBNG, REF, FBP, SEQ to GND .....-0.3V to (VIN + 0.3V)

LXP, HVINP to GND..............................................-0.3V to +22V

PGVDD, POS to GND........................... -0.3V to VHVINP + 0.3V

NEG to GND..........................................................-24V to +0.3V

LXN to INN ............................................................-24V to +0.3V

DP, DN to PGND ................................. -0.3V to (VHVINP + 0.3V)

DGVDD to GND ....................................................-0.3V to +24V

DGVEE to GND.....................................................-24V to +0.3V

GND to PGND......................................................-0.3V to +0.3V

GND to LGND ......................................................-0.3V to +0.3V

Continuous Power Dissipation (TA = +70°C)

TQFN (derate 34.5mW/°C above +70°C),

Multilayer Board.........................................................2759mW

Operating Temperature Range......................... -40°C to +105°C

Junction Temperature......................................................+150°C

Storage Temperature Range............................ -65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow).........................................260°C

TQFN

Junction-to-Ambient Thermal Resistance (θJA) ..........29°C/W

Junction-to-Case Thermal Resistance (θJC)..............1.7°C/W

(Note 1)

Electrical Characteristics

(VIN = 3.6V, VBATT = 12V, Typical operating circuit as Figure 5, = -40°C to +105°C, unless otherwise noted. Typical values are at

TA = +25°C.) (Note 2)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

INPUT SUPPLY

IN Voltage Range

2.7

5.5

IN UVLO Threshold

Rising

2.45

2.55

2.65

IN UVLO Hysteresis

100

IN Quiescent Current

VEN = VGND, VIN = 3.6V

μA

IN Quiescent Current

VEN = VIN = 3.6V, no switching

2.2

REFERENCE

Reference Output Voltage

No load

1.234

1.25

1.266

Reference UVLO Threshold

REF rising

1.2

Reference UVLO Hysteresis

100

Reference Load Regulation

0 < IREF < 100μA

Reference Line Regulation

2.7V < VIN < 5.5V

BOOST REGULATOR

Output Voltage Range

VHVINP

VIN

VPOS

POS Output Regulation

VFBP = VGND, VIN = 2.7V to

5.5V, 1mA < IPOS < 100mA

6.37

6.5

6.63

Operating Frequency

Dither disabled (test mode

only), OTP options for 400kHz

and 2.1MHz

850

1000

1150

kHz

MAX20070

Integrated TFT Power Supply and

LED Backlight Driver

www.maximintegrated.com

Maxim Integrated │ 2

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Thermal Characteristics

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