VCC

RXP

RXN

OS

4

1

DE

TXP

TXN

EQ

8

5

3

2

7

6

GND

TUSB501

SLLSEG5A – AUGUST 2013 – REVISED AUGUST 2013

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

DRF PACKAGE

(TOP VIEW)

PIN FUNCTIONS

PIN

TYPE

DESCRIPTION

NAME

NO.

RXP

2

Differential input pair for 5 Gbps SuperSpeed USB signals.

RXN

3

Differential I/O

TXN

6

Differential output pair for 5 Gbps SuperSpeed USB signals.

TXP

7

Sets the receiver equalizer gain. 3-state input with integrated pull-up and pull-

EQ

5

down resistors.

Sets the output de-emphasis gain. 3-state input with integrated pull-up and pull-

DE

CMOS Input

8

down resistors.

Sets the output swing (differential voltage amplitude). 2-state input with an

OS

4

integrated pull-down resistor.

VCC

1

3.3-V power supply

Power

GND

Thermal Pad

Reference ground

2

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