STPS3L40SY datasheet(4/7 Pages) STMICROELECTRONICS

4 / 7 page

Characteristics

STPS3L40-Y

4/7

Doc ID 018562 Rev 1

Figure 7.

Reverse leakage current versus

reverse voltage applied

(typical values)

Figure 8.

Junction capacitance versus

reverse voltage applied

(typical values)

Figure 9.

Forward voltage drop versus

forward current

Figure 10.

Thermal resistance junction to

ambient versus copper surface

under each lead

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

I (mA)

V (V)

T =125°C

T =100°C

T =25°C

100

1000

110

100

C(pF)

V (V)

F=1MHz

=30mV

T =25°C

OSC

RMS

(A)

0.01

0.10

1.00

10.00

100.00

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

j=25°C

(Maximum values)

j=125 °C

(Typical values)

j=125 °C

(Typical values)

j=125 °C

(Maximum values)

j=125 °C

(Maximum values)

(V)

100

110

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

(cm²)

(°C/W)

th(j-a)

epoxy printed board FR4, copper thickness = 35 µm

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