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STPS0540ZY 数据表(PDF) 3 Page - STMicroelectronics |
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STPS0540ZY 数据表(HTML) 3 Page - STMicroelectronics |
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3 / 7 page ![]() STPS0540-Y Characteristics Doc ID 17966 Rev 1 3/7 Figure 1. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature ( δ = 0.5) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.00 0.05 0.10 0.15 0.20 0.25 0.30 IF(av) (A) PF(av)(W) δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5 δ = 1 T δ=tp/T tp 0 25 50 75 100 125 0.0 0.1 0.2 0.3 0.4 0.5 0.6 Tamb(°C) IF(av)(A) T δ=tp/T tp Figure 3. Non repetitive surge peak forward current versus overload duration (maximum values) Figure 4. Relative variation of thermal impedance junction to ambient versus pulse duration 1E-3 1E-2 1E-1 1E+0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 t(s) IM(A) IM t δ=0.5 Ta = 25°C 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 1E-3 1E-2 1E-1 1E+0 tp(s) Zth(j-a)/Rth(j-a) T δ=tp/T tp δ = 0.5 δ = 0.2 δ = 0.1 Single pulse Epoxy printed circuit board FR4 with recommended pad layout Figure 5. Reverse leakage current versus reverse voltage applied (typical values) Figure 6. Reverse leakage current versus junction temperature (typical values) 0 5 10 15 20 25 30 35 40 1E-4 1E-3 1E-2 1E-1 1E+0 1E+1 5E+1 VR(V) IR(mA) Tj=70°C Tj=25°C Tj=100°C Tj=125°C 0 25 50 75 100 125 1E-1 1E+0 1E+1 1E+2 1E+3 Tj(°C) IR[Tj] / IR[Tj=25°C] VR=VRRM |
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