MPX12

Sensors

6

Freescale Semiconductor

Pressure

Figure 4. Cross-Sectional Diagram (not to scale)

the die surface and wire bonds from the environment, while

allowing the pressure signal to be transmitted to the silicon

diaphragm.

Operating characteristics, internal reliability and

qualification tests are based on use of dry clean air as the

pressure media. Media other than dry clean air may have

adverse effects on sensor performance and long term

reliability. Contact the factory for information regarding media

compatibility in your application.

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Freescale designates the two sides of the pressure sensor

as the Pressure (P1) side and the Vacuum (P2) side. The

Pressure (P1) side is the side containing gel which isolates

the die from the environment. Freescale’s MPx12 series is

designed to operate with positive differential pressure

applied, P1 > P2.

The Pressure (P1) side may be identified by using the

following table

Gel Die Coat

Wire Bond

Die

P1

Stainless

Steel Cap

Thermoplastic

Case

Die Bond

Differential Sensing

Element

P2

Lead Frame

Part Number

Case Type

Pressure (P1) Side

Identifier

MPX12D

344

Stainless Steel Cap

MPX12DP

344C

Side with Part Marking

MPX12GP

344B

Side with Port Attached

MPXV12DP

1351

Side with Part Marking

MPXV12GP

1369

Side with Port

MPXV12GW6U

1735

Side with Port

MPXV12GW7U

1560

Side with Port

MPXM12GS/GST1

1320A

Side with Port Attached