TDA2040

Applications

Doc ID 1460 Rev 6

13/16

3.3

Practical considerations

3.3.1

Printed circuit board

The layout shown in Figure 14 should be adopted by the designers. If different layouts are

used, the ground points of input 1 and input 2 must be well decoupled from the ground

return of the output in which a high current flows.

3.3.2

Assembly suggestion

No electrical isolation is needed between the package and the heatsink with single supply

voltage configuration.

3.3.3

Application suggestions

The recommended values of the components are those shown in the application circuit of

Figure 13. However, if different values are chosen then the following table can be helpful.

Table 5.

Variations from recommended values

Component

Recommended

value

Purpose

Larger than

recommended value

Smaller than

recommended value

R1

22 k

Ω

Non-inverting

input biasing

Increase in input

impedance

Decrease in input

impedance

R2

680

Ω

Closed-loop

gain setting

1.

The value of closed loop gain must be higher than 24 dB

Increase in gain

R3

22 k

Ω

Closed-loop

gain setting

Increase in gain

Decrease in gain (1)

R4

4.7

Ω

Frequency

stability

Danger of oscillation at

high frequencies with

inductive loads

-

C1

1 µF

Input DC

decoupling

-

Increase in

low-frequency cut-off

C2

22 µF

Inverting DC

decoupling

-

Increase in

low-frequency cut-off

C3, C4

0.1 µF

Supply voltage

bypass

-

Danger of oscillation

C5, C6

220

μF

Supply voltage

bypass

-

Danger of oscillation

C7

0.1

μF

Frequency

stability

-

Danger of oscillation

Obsolete

Product(s)

- Obsolete

Product(s)