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ELJNDR10F 数据表(PDF) 1 Page - Panasonic Semiconductor |
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ELJNDR10F 数据表(HTML) 1 Page - Panasonic Semiconductor |
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1 / 8 page ![]() Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Fixed Inductors (Chip Inductors) 123456789 10 11 Shape Size : mm (inch) Product code Inductance Packaging Design No. Taping Inductance tolerance F Chip Inductors RF RE ND NC NA 1005 (0402) 1608 (0603) 2012 (0805) 2520 (1008) 3225 (1210) 1.5 nH 10 nH 220 nH 3.3 μH 1N5 10N R22 3R3 ±0.2 nH ±0.3 nH ±2 % ±5 % ±10 % ±20 % Z D G J K M 123456789 10 11 1. High Frequency Use (Non Magnetic Core) RF, RE, ND, NC, NA ■ Features ● High frequency capability due to its non magnetic core. ● Capable of being Re-flow or flow soldered. ● Wide line-up from 1005 to 3225 case sizes. ● Good for mounting. ● RoHS compliant ■ Recommended Applications ● RF circuitry for cellular phones and wireless communication equipment. ■ Explanation of Part Numbers ■Storage Conditions ● Package : Normal temperature (–5 to 35 °C), normal humidity (85 %RH max.), shall not be exposed to direct sunlight and harmful gases and care should be taken so as not to cause dew. ● Operating Temperature : –40 to +85 °C (RF, RE) –20 to +85 °C (ND, NC, NA) ■Storage Period ● Solderability may be reduced due to the conditions of high temperature and high humidity which causes the oxidation of tin-plated terminals. Even if storage conditions are within specified limits, solderability may be reduced with the passage of time. Therefore, please control the storage conditions and try to use the product within 6 months of receipt. ■Packaging Methods, Soldering Conditions and Safety Precautions Please see Data Files. Sep. 2012 01 3 |
类似零件编号 - ELJNDR10F |
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类似说明 - ELJNDR10F |
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