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SSL21081AT 数据表(PDF) 12 Page - NXP Semiconductors |
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SSL21081AT 数据表(HTML) 12 Page - NXP Semiconductors |
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12 / 22 page ![]() SSL21081AT All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 6 — 3 October 2013 12 of 21 NXP Semiconductors SSL21081AT Compact non-dimmable LED driver IC 9. Limiting values [1] The current into the VCC pin must not exceed the maximum IDD value. [2] An internal clamp sets the supply voltage. [3] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. [4] Charged device model: equivalent to charging the IC up to 1 kV and the subsequent discharging of each pin down to 0 V over a 1 resistor. 10. Thermal characteristics Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit General SR slew rate on pin DRAIN 5 +5 V/ns Ptot total power dissipation SO8 package - 0.6 W Tamb ambient temperature 40 +125 C Tj junction temperature 40 +150 C Tstg storage temperature 55 +150 C Voltages VCC supply voltage continuous [1] 0.4 +20 V VDRAIN voltage on pin DRAIN 0.4 +300 V VHV voltage on pin HV current limited 0.4 +300 V VSOURCE voltage on pin SOURCE current limited 0.4 +5.2 V VNTC voltage on pin NTC current limited 0.4 +5.2 V Currents IDD supply current at pin VCC [2] - 20 mA IDRAIN current on pin DRAIN 2 +2 A ISOURCE current on pin SOURCE 2 +2 A IDVDT current on pin DVDT duration 20 s maximum - 1.3 A VESD electrostatic discharge voltage human body model; pins DRAIN and HV [3] 1 +1 kV human body model; all other pins 2 +2 kV charged device [4] 500 +500 V Table 6. Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-a) thermal resistance from junction to ambient in free air; SO8 package, PCB: 2 cm 3 cm, 2-layer, 35 m Cu per layer 142 K/W in free air; SO8 package; PCB: JEDEC 2s2p 72 K/W j-top thermal characterization parameter from junction to top of package top package temperature measured at the warmest point on top of the case; SO8 package 3.4 K/W |
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