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SSL21083AT 数据表(PDF) 12 Page - NXP Semiconductors |
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SSL21083AT 数据表(HTML) 12 Page - NXP Semiconductors |
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12 / 23 page ![]() SSL21083AT All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 6 — 4 October 2013 12 of 22 NXP Semiconductors SSL21083AT Compact non-dimmable LED driver IC 8.8 Heat sink The copper of the PCB acts as the heat sink for SSL21083AT applications. Equation 1 shows the relation between the maximum allowable power dissipation P and the thermal resistance from junction to ambient. (1) Where: Rth(j-a) = thermal resistance from junction to ambient Tj(max) = maximum junction temperature Tamb = ambient temperature P = power dissipation R th j a – T jmax T amb – P = |
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