Pad Assignment

Chip size: 121

* The IC substrate should be connected to VDD in the PCB layout artwork.

Pad Coordinates

Unit: mil

Pad No.

X

Y

Pad No.

X

Y

1

–54.78

54.10

19

20.27

–56.53

2

–54.78

46.45

20

54.78

–56.53

3

–54.78

39.10

21

54.78

–49.30

4

–54.78

31.45

22

54.78

–37.99

5

–54.78

24.10

23

54.78

–25.58

6

–54.78

16.45

24

54.78

–1.02

7

–54.78

9.10

25

54.02

8.50

8

–54.78

1.45

26

54.02

15.13

9

–54.78

–5.91

27

54.02

27.11

10

–54.78

–13.56

28

51.13

55.85

11

–52.53

–56.53

29

44.50

55.85

12

–44.46

–56.53

30

37.87

55.85

13

–37.10

–56.53

31

31.24

55.85

14

–29.88

–56.53

32

18.02

56.61

15

–22.82

–56.53

33

1.95

56.61

16

–5.31

–56.53

34

–17.34

56.61

17

5.40

–56.53

35

–23.97

56.61

18

13.64

–56.53

36

–40.97

56.61

HT7501

2

8th Feb ’99