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IXDN430 数据表(PDF) 5 Page - IXYS Corporation

部件名 IXDN430
功能描述  30 Amp Low-Side Ultrafast MOSFET / IGBT Driver
PDF  12 Pages
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制造商  IXYS [IXYS Corporation]
网页  http://www.ixys.com
标志 IXYS - IXYS Corporation

IXDN430 数据表(HTML) 5 Page - IXYS Corporation

  IXDN430 Datasheet HTML 1Page - IXYS Corporation IXDN430 Datasheet HTML 2Page - IXYS Corporation IXDN430 Datasheet HTML 3Page - IXYS Corporation IXDN430 Datasheet HTML 4Page - IXYS Corporation IXDN430 Datasheet HTML 5Page - IXYS Corporation IXDN430 Datasheet HTML 6Page - IXYS Corporation IXDN430 Datasheet HTML 7Page - IXYS Corporation IXDN430 Datasheet HTML 8Page - IXYS Corporation IXDN430 Datasheet HTML 9Page - IXYS Corporation Next Button
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5
IXDN430 / IXDI430 / IXDD430 / IXDS430
Pin Description
SYMBOL
FUNCTION
DESCRIPTION
VCC
Supply Voltage
Positive power-supply voltage input. This pin provides power to the
entire chip. The range for this voltage is from 8.5V to 35V.
IN
Input
Input signal-TTL or CMOS compatible.
EN *
Enable
The system enable pin. This pin, when driven low, disables the chip,
forcing high impedance state to the output (IXDD430 Only).
INV
Invert
Forcing INV low causes the IXDS430 to become non-inverted, while
forcing INV high causes the IXDS430 to become inverted.
OUT P
OUT N
Output
Respective P and N driver outputs. For application purposes this pin
is connected, through a resistor, to Gate of a MOSFET/IGBT. The P
and N output pins are connected together in the TO-263 and TO-220
packages.
GND
Ground
The system ground pin. Internally connected to all circuitry, this pin
provides ground reference for the entire chip. This pin should be
connected to a low noise analog ground plane for optimum
performance.
UVSEL
Select Under
Voltage Level
W ith UVSEL connected to Vcc, IXDS430 outputs go low at Vcc <
8.5V; W ith UVSEL open, under voltage level is set at Vcc < 12.5V
Figure 2 - Characteristics Test Diagram
* This pin is used only on the IXDD430, and is N/C (not connected) on the IXDI430 and IXDN430.
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD procedures when
handling and assembling this component.
TO220 (CI)
TO263 (YI)
Vcc
OUT
GND
IN
EN*
1
2
3
4
5
Pin Configurations
(SI-CT)
28 Pin SOIC
Vcc 4
Vcc 3
Vcc 2
Vcc 1
25 Vcc
26 Vcc
27 Vcc
28 Vcc
18 GND
GND 11
16 GND
17 GND
15 GND
GND 13
GND 12
22 OUT P
23 OUT P
24 OUT P
19 OUT N
20 OUT N
21 OUT N
GND 14
N/C 7
N/C 5
UVSEL 6
IN 8
EN 9
INV 10
+
Vin
-
Vcc
EN
IN
GND
OUT
Vcc
+
IXDD430
C
LOAD
-
C
BYPASS/
.
.
FILTER



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