DocID17741 Rev 5

7/12

SM6TY

Characteristics

12

Figure 10. Junction capacitance versus reverse

applied voltage for unidirectional types

(typical values)

Figure 11. Junction capacitance versus reverse

applied voltage for bidirectional types

(typical values)

C(pF)

10

100

1000

10000

1

10

100

1000

SM6T6V8AY

SM6T30AY

SM6T82AY

F = 1 Mhz

V

= 30 mV

T = 25 °C

OSC

RMS

j

V(V)

R

100

1000

10000

1

10

100

1000

C(pF)

SM6T6V8CAY

SM6T30CAY

SM6T82CAY

F = 1 Mhz

V

= 30 mV

T = 25 °C

OSC

RMS

j

V(V)

R

Figure 12. Relative variation of thermal

impedance junction to ambient versus pulse

duration

Figure 13. Thermal resistance junction to

ambient versus copper surface under each lead

Zth (j-a)/Rth (j-a)

0.01

0.10

1.00

1.0E-03

1.0E-02

1.0E-01

1.0E+00

1.0E+01

1.0E+02

1.0E+03

Recommended pad layout

Printed circuit board FR4, copper thickness = 35 µm

s

tp

Figure 14. Leakage current versus junction

temperature (typical values)

Figure 15. Peak forward voltage drop versus

peak forward current (typical values)

I

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

25

50

75

100

125

150

V

V

V

V

T (° C)

j

1.0E-02

1.0E-01

1.0E+00

1.0E+01

1.0E+02

0.0

0.5

1.0

1.5

2.0

2.5

3.0

I

T

T