MBRF4030CT datasheet(3/5 Pages) SMC

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SANGDEST

MICROELECTRONICS

Technical Data

Green Products

Data Sheet N1118, Rev. A

• Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113

(86) 25-87123907

•

• FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn •

MBRF4030CT

Electrical Characteristics:

Characteristics

Symbol

Condition

Max.

Units

VF1

@ 20A, Pulse, TJ = 25 °C

0.55

Max. Forward Voltage Drop

(per leg)*

VF2

@ 20A, Pulse, TJ = 125 °C

0.50

Max. Reverse Current at DC

condition

IR1

@VR = rated VR

TJ = 25 °C

Max. Reverse Current

IR2

@VR = rated VR

TJ = 125

°C

Max. Junction Capacitance

@VR = 5V, TC = 25

°C

fSIG = 1MHz

500

Typical Series Inductance

Measured lead to lead 5 mm from

package body

8.0

Max. Voltage Rate of

Change(Rated VR)

dv/dt

10,000

µs

* Pulse Width < 300µs, Duty Cycle <2%

Thermal-Mechanical Specifications:

Characteristics

Symbol

Condition

Specification

Units

Max. Junction Temperature

-55 to +150

°C

Max. Storage Temperature

Tstg

-55 to +150

°C

Maximum Thermal

Resistance Junction to Case

(per leg)

RθJC

DC operation

3.25

°C/W

Typical Thermal Resistance,

case to Heat Sink

Rθcs

Mounting surface, smooth and

greased

0.50

°C/W

Approximate Weight

Case Style

ITO-220AB

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