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HM17CM256 数据表(PDF) 2 Page - Hynix Semiconductor |
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HM17CM256 数据表(HTML) 2 Page - Hynix Semiconductor |
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2 / 111 page ![]() HM17CM256 - 2 - PAD LAYOUT note 1) The (L) (R) (C) mark after port name is internally shorted. note 2) DMYport is opened electrically. chip center : X= 0 µµm, Y= 0µµm chip size : with scribe lane : 19.84mm x 2.48mm , main chip : 19.74mm x 2.38mm chip thickness : 625 µµm ±± 25µµm bump size : 100 µµm x 32µµm, 100µµm x 80µµm bump pitch : 50 µµm(Min) bump height : 18 ±± 3µµm bump material : Au align mark appearance and size a : 30 µµm b : 6 µµm c : 120 µµm d : 27 µµm coordinates of align marks (X= - 9732 µµm, Y= -1052µµm) (X= 9732 µµm, Y= -1052µµm) a a c c b b d d 1 COM40 SEGSC3 SEGSA2 DMY6(R) DMY6(L) DMY7(R) DMY7(L) COM66 |
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