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VNH7013XP-E 数据表(PDF) 16 Page - STMicroelectronics |
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VNH7013XP-E 数据表(HTML) 16 Page - STMicroelectronics |
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16 / 24 page ![]() Package and PCB thermal data VNH7013XP-E 16/24 Doc ID 022370 Rev 3 Figure 13. Chipset configuration Figure 14. Auto and mutual Rthj-amb vs PCB copper area in open box free air condition 3.1.1 Thermal calculation in clockwise and anti-clockwise operation in steady-state mode Note: Referred to double layer PCB Table 14. Thermal calculation in clockwise and anti-clockwise operation in steady- state mode HSA HSB LSA LSB TjHSAB TjLSA TjLSB ON OFF OFF ON PdHSA x RthHS + PdLSB x RthHSLS + Tamb PdHSA x RthHSLS + PdLSB x RthLSLS + Tamb PdHSA x RthHSLS + PdLSB x RthLS + Tamb OFF ON ON OFF PdHSB x RthHS + PdLSA x RthHSLS + Tamb PdHSB x RthHSLS + PdLSA x RthLS + Tamb PdHSB x RthHSLS + PdLSA x RthLSLS + Tamb |
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