TDA7493 datasheet(28/30 Pages) STMICROELECTRONICS

部件名	TDA7493

功能描述	3-watt 3-watt dual BTL class-D audio amplifier

PDF	30 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

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28 / 30 page

Heatsink provision

TDA7493

28/30

Doc ID 14570 Rev 6

Heatsink provision

With the exposed-pad packages, it is possible to use the printed circuit board as a heatsink.

Using a PCB copper ground area of 3 x 3 cm2 with 16 via holes to make contact with the

exposed pad, a thermal resistance of 37 °C/W can be achieved.

The amount of power dissipated within the device depends primarily on the supply voltage,

load impedance and output modulation level. The maximum estimated power dissipation for

the TDA7493 is around 1.1 W.

With the suggested copper area of 9 cm2, a maximum junction temperature increase of less

than 40 °C above ambient can be expected, thus giving a maximum junction temperature,

Tj, of approximately 90 °C in consumer environments where 50 °C is specified as the

maximum ambient temperature. This provides a comfortable safety margin to the thermal

protection threshold at Tj = 150 °C.

TDA7493 数据表(PDF) 28 Page - STMicroelectronics