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ADC0804LCD 数据表(PDF) 16 Page - Intersil Corporation |
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ADC0804LCD 数据表(HTML) 16 Page - Intersil Corporation |
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16 / 16 page ![]() 6-20 Die Characteristics DIE DIMENSIONS: (101 mils x 93 mils) x 525 µm x 25µm METALLIZATION: Type: Al Thickness: 10k Å ±1kÅ PASSIVATION: Type: Nitride over Silox Nitride Thickness: 8k Å Silox Thickness: 7k Å Metallization Mask Layout ADC0802, ADC0803, ADC0804 WR RD CS CLK IN INTR VIN (-) VIN (+) DGND VREF/2 AGND V+ OR VREF CLK R DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7 (MSB) V+ OR VREF ADC0802, ADC0803, ADC0804 All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com |
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