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HCS02MS

Die Characteristics

DIE DIMENSIONS:

87 x 88 mils

2.20mm x 2.24mm

METALLIZATION:

Type: AlSi

Metal Thickness: 11k

Å

GLASSIVATION:

Thickness: 13k

Å

WORST CASE CURRENT DENSITY:

BOND PAD SIZE:

100

µm x 100µm

4 x 4 mils

Metallization Mask Layout

HCS02MS

Y1

VCC

Y4

A1 (2)

B1 (3)

Y2 (4)

A2 (5)

(12) B4

(11) A4

(10) Y3

(9) B3

(6)

(7)

(8)

(1)

(14)

(13)

B2

GND

A3

Spec Number

518744