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HCS32MS 数据表(PDF) 8 Page - Intersil Corporation |
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HCS32MS 数据表(HTML) 8 Page - Intersil Corporation |
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8 / 8 page ![]() 80 Die Characteristics DIE DIMENSIONS: 87 x 88 mils 2.20 x 2.2mm METALLIZATION: Type: SiAl Metal Thickness: 11k Å ± 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å ± 2.6kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 µm x 100µm 4 x 4 mils Metallization Mask Layout HCS32MS A1 VCC B4 B1 (2) Y1 (3) A2 (4) B2 (5) (6) (7) (8) (9) A3 (10) B3 (11) Y4 (12) A4 (1) (14) (13) Y2 GND Y3 HCS32MS Spec Number 518768 |
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