Data Sheet

ADCMP551/ADCMP552/ADCMP553

Rev. A | Page 15 of 16

Figure 27. 8-Lead Mini Small Outline Package [MSOP]

(RM-8)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

Branding

ADCMP551BRQ

−40°C to +85°C

16-Lead Shrink Small Outline Package [QSOP]

RQ-16

ADCMP551BRQZ

−40°C to +85°C

16-Lead Shrink Small Outline Package [QSOP]

RQ-16

ADCMP551BRQZ-REEL7

−40°C to +85°C

16-Lead Shrink Small Outline Package [QSOP]

RQ-16

EVAL-ADCMP551BRQZ

Evaluation Board

ADCMP552BRQ

−40°C to +85°C

20-Lead Shrink Small Outline Package [QSOP]

RQ-20

ADCMP552BRQZ

−40°C to +85°C

20-Lead Shrink Small Outline Package [QSOP]

RQ-20

EVAL-ADCMP552BRQZ

Evaluation Board

ADCMP553BRMZ

−40°C to +85°C

8-Lead Mini Small Outline Package [MSOP]

RM-8

BR53

EVAL-ADCMP553BRMZ

Evaluation Board

COMPLIANT TO JEDEC STANDARDS MO-187-AA

6°

0°

0.80

0.55

0.40

4

8

1

5

0.65 BSC

0.40

0.25

1.10 MAX

3.20

3.00

2.80

COPLANARITY

0.10

0.23

0.09

3.20

3.00

2.80

5.15

4.90

4.65

PIN 1

IDENTIFIER

15° MAX

0.95

0.85

0.75

0.15

0.05