µPC3207GR

19

Data Sheet P13717EJ3V0DS00

NOTE ON CORRECT USE

(1) Observe precautions for handling because of electro-static sensitive devices.

(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesires oscillation).

(3) Keep the track length of the ground pins as short as possible.

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered under the following recommended conditions. For soldering methods and

conditions other than those recommended below, contact your NEC sales representative.

Soldering Method

Soldering Conditions

Infrared Reflow

Package peak temperature: 235

°C or below

Time: 30 seconds or less (at 210

°C)

VPS

Package peak temperature: 215

°C or below

Time: 40 seconds or less (at 200

°C)

Partial Heating

Pin temperature: 300

°C

Time: 3 seconds or less (per side of device)

Note After opening the dry pack, keep it in a place below 25

°C and 65 % RH for the allowable storage period.

Caution Do not use different soldering methods together (except for partial heating).

For details of recommended soldering conditions for surface mounting, refer to information document

SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).

Recommended

Condition Symbol

IR35-00-3

VP15-00-3

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