7

µPC337

RECOMMENDED SOLDERING CONDITIONS

When soldering these products, it is highly recommended to observe the conditions as shown below. If other

soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult

with our sales offices.

For more details, refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL"

(C10535E).

Type of Through-hole Devices

µPC337HF: 3-pin plastic SIP (MP-45G)

Process

Conditions

Wave soldering

Solder temperature: 260

°C or below,

(only to leads)

Flow time: 10 seconds or less.

Partial heating method

Pin temperature: 300

°C or below,

Heat time: 3 seconds or less (per each lead).

Caution For through-hole device, the wave soldering process must be applied only to leads, and make

sure that the package body does not get jet soldered.

REFERENCE DOCUMENTS

QUALITY GRADES ON NEC SEMICONDUCTOR DEVICES

C11531E

SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL

C10535E

NEC IC PACKAGE MANUAL (CD-ROM)

C13388E

GUIDE TO QUALITY ASSURANCE FOR SEMICONDUCTOR DEVICES

MEI-1202

SEMICONDUCTORS SELECTION GUIDE

X10679E

NEC SEMICONDUCTOR DEVICE RELIABILITY/QUALITY CONTROL SYSTEM

IEI-1212

–THREE TERMINAL REGULATOR