ADP1653

Rev. B | Page 6 of 24

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

SETI, SETT, SETF, STR, HPLED to GND

−0.3 V to +6 V

INT, ILED to GND

LX, OUT to GND

−0.3 V to +12 V

PGND to GND

−0.3 V to +0.3 V

Operating Ambient Temperature Range

−40°C to +125°C1

Operating Junction Temperature

125°C

Storage Temperature Range

−65°C to +150°C

Soldering Conditions

JEDEC J-STD-020

are present, the maximum ambient temperature may have to be derated.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Absolute maximum ratings apply individually only, not in

combination. Unless otherwise specified, all other voltages

are referenced to GND.

THERMAL RESISTANCE

based on modeling and calculation using a 4-layer board. The

junction-to-ambient thermal resistance is dependent on the

application and board layout. In applications where high maximum

power dissipation exists, attention to thermal board design is

layout, and environmental conditions. For more information,

see the AN-772 Application Note, A Design and Manufacturing

Guide for the Lead Frame Chip Scale Package (LFCSP).

Table 4. Thermal Resistance

Parameter

Value

Unit

44

°C/W

Maximum Power Dissipation

1

W

BOUNDARY CONDITION

Natural convection, 4-layer board, exposed pad soldered to

the PCB.

ESD CAUTION