BIPOLAR ANALOG INTEGRATED CIRCUIT

3 V, 2.9 GHz SILICON MMIC

MEDIUM OUTPUT POWER AMPLIFIER

FOR MOBILE COMMUNICATIONS

DESCRIPTION

The

operates at 3 V. The medium output power is suitable for RF-TX of mobile communications system.

process uses direct silicon nitride passivation film and gold electrodes. These materials can protect the chip surface

from pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.

FEATURES

• High-density surface mounting: 6-pin super minimold package (2.0

× 1.25 × 0.9 mm)

APPLICAION

• Buffer amplifiers on 1.9 to 2.4 GHz mobile communications system

ORDERING INFORMATION (Solder Contains Lead)

Part Number

Package

Marking

Supplying Form

6-pin super minimold

C3F

• Embossed tape 8 mm wide

• Pin 1, 2, 3 face the perforation side of the tape

• Qty 3 kpcs/reel

Remark To order evaluation samples, contact you’re nearby sales office. Part number for sample order:

ORDERING INFORMATION (Pb-Free)

Part Number

Package

Marking

Supplying Form

6-pin super minimold

C3F

• Embossed tape 8 mm wide

• Pin 1, 2, 3 face the perforation side of the tape

• Qty 3 kpcs/reel

*NOTE: Please refer to the last page of this data sheet, “Compliance with EU Directives” for Pb-Free RoHS

Compliance Information.

Document No. PU10206EJ01V0DS (1st edition)

(Previous No. P14543EJ2V0DS00)

Date Published December 2002 CP (K)

2002