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XC6503

Series

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PACKAGING INFORMATION (Continued)

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USP-4 Power Dissipation

Power dissipation data for the USP-4 is shown in this page.

The value of power dissipation varies with the mount board conditions.

Please use this data as one of reference data taken in the described condition.

Board Mount (Tj max = 125℃)

Ambient Temperature（℃）

Power Dissipation Pd（mW）

Thermal Resistance (℃/W)

25

1000

85

400

100.00

1.

Measurement Condition (Reference data)

Condition:

Mount on a board

Ambient:

Natural convection

Soldering:

Lead (Pb) free

Board:

Dimensions 40 x 40 mm (1600 mm

Copper (Cu) traces occupy 50% of the board area

In top and back faces

Package heat-sink is tied to the copper traces

Material:

Glass Epoxy (FR-4)

Thickness:

1.6 mm

Through-hole:

4 x 0.8 Diameter

Evaluation Board (Unit：mm)

Evaluation Board (Unit: mm)

2. Power Dissipation vs. Ambient temperature

Pd Vs. Ta

0

200

400

600

800

1000

1200

25

45

65

85

105

125

Ambient TemperatureTa: （℃）

Ambient Temperature: Ta (℃)