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IRFP360LC 数据表(PDF) 1 Page - International Rectifier |
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IRFP360LC 数据表(HTML) 1 Page - International Rectifier |
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1 / 8 page ![]() IRFP360LC HEXFET® Power MOSFET PD - 9.1230 Revision 0 VDSS = 400V RDS(on) = 0.20Ω ID = 23A Ultra Low Gate Charge Reduced Gate Drive Requirement Enhanced 30V Vgs Rating Reduced Ciss, Coss, Crss Isolated Central Mounting Hole Dynamic dv/dt Rated Repetitive Avalanche Rated Absolute Maximum Ratings Parameter Max. Units ID @ TC = 25°C Continuous Drain Current, V GS @ 10V 23 ID @ TC = 100°C Continuous Drain Current, V GS @ 10V 14 A IDM Pulsed Drain Current 92 PD @TC = 25°C Power Dissipation 280 W Linear Derating Factor 2.2 W/°C VGS Gate-to-Source Voltage ±30 V EAS Single Pulse Avalanche Energy 1200 mJ IAR Avalanche Current 23 A EAR Repetitive Avalanche Energy 28 mJ dv/dt Peak Diode Recovery dv/dt 4.0 V/ns TJ Operating Junction and -55 to + 150 TSTG Storage Temperature Range °C Soldering Temperature, for 10 seconds 300 (1.6mm from case) Mounting torque, 6-32 or M3 screw. 10 lbf•in (1.1N•m) Parameter Min. Typ. Max. Units RθJC Junction-to-Case –––– –––– 0.45 RθCS Case-to-Sink, Flat, Greased Surface –––– 0.24 –––– °C/W RθJA Junction-to-Ambient –––– –––– 40 Thermal Resistance Description This new series of Low Charge HEXFET Power MOSFETs achieve significantly lower gate charge over conventional MOSFETs. Utilizing advanced Hexfet technology the device improvements allow for reduced gate drive requirements, faster switching speeds and increased total system savings. These device improvements combined with the proven ruggedness and reliability of HEXFETs offer the designer a new standard in power transistors for switching applications. The TO-247 package is preferred for commercial-industrial applications where higher power levels preclude the use of TO-220 devices. The TO-247 is similar but superior to the earlier TO-218 package because of its isolated mounting hole. Next Data Sheet Index Previous Datasheet To Order |
类似零件编号 - IRFP360LC |
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类似说明 - IRFP360LC |
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