AN3383 datasheet(3/29 Pages) STMICROELECTRONICS

3 / 29 page

AN3383

List of figures

Doc ID 018691 Rev 1

3/29

List of figures

Figure 1.

STA350BW 2.0-channel demonstration board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Figure 2.

Schematic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Figure 3.

Block diagram of test connections with equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Figure 4.

Top view of PCB layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Figure 5.

Bottom view of PCB layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Figure 6.

Efficiency (2 channels, BTL configuration), VCC = 26 V, RL = 6 ohm . . . . . . . . . . . . . . . . . . 9

Figure 7.

Efficiency (2 channels, BTL configuration), VCC = 26 V, RL = 8 ohm . . . . . . . . . . . . . . . . . 10

Figure 8.

Output power vs. supply voltage, RL = 6 ohm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Figure 9.

Output power vs. supply voltage, RL = 8 ohm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Figure 10.

Frequency response, VCC = 24 V, RL = 6 ohm, 0 dB (Pout = 1 W) . . . . . . . . . . . . . . . . . . 11

Figure 11.

Crosstalk, VCC = 24 V, RL = 6 ohm, 0 dB (Pout = 1 W) . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Figure 12.

SNR, VCC = 24 V, RL = 6 ohm, 0 dB (Pout = 1 W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Figure 13.

THD vs. frequency, VCC = 24 V, RL = 6 ohm, Pout = 1 W . . . . . . . . . . . . . . . . . . . . . . . . . 12

Figure 14.

FFT (0 dBFS), VCC = 24 V, RL = 6 ohm, 0 dBFS (Pout = 1 W) . . . . . . . . . . . . . . . . . . . . . 13

Figure 15.

FFT (-60 dBFS), VCC = 24 V, RL = 6 ohm, 0 dBFS (Pout = 1 W) . . . . . . . . . . . . . . . . . . . . 13

Figure 16.

THD vs. output power, VCC = 24 V, RL = 6 ohm, f = 1 kHz . . . . . . . . . . . . . . . . . . . . . . . . 13

Figure 17.

Output power = 2 x 5 W, VCC = 26 V, load = 6 ohm, frequency = 1 kHz . . . . . . . . . . . . . . 14

Figure 18.

Output power = 2 x 10 W, VCC = 26 V, load = 6 ohm, frequency = 1 kHz . . . . . . . . . . . . . 14

Figure 19.

Output power = 2 x 15 W, VCC = 26 V, load = 6 ohm, frequency = 1 kHz . . . . . . . . . . . . . 15

Figure 20.

Output power = 2 x 38 W, VCC = 26 V, load = 8 ohm, frequency = 1 kHz . . . . . . . . . . . . . 15

Figure 21.

Output filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Figure 22.

Power dissipated over the series resistance [P = C*f*(2*V)2]. . . . . . . . . . . . . . . . . . . . . . . 17

Figure 23.

Power dissipated over the series resistance [P = C*f*2(V2)] . . . . . . . . . . . . . . . . . . . . . . . 17

Figure 24.

Damping network . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Figure 25.

Main filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Figure 26.

Recommended power-up and power-down sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Figure 27.

Snubber network soldered as close as possible to the related IC pin . . . . . . . . . . . . . . . . 19

Figure 28.

Electrolytic capacitor used first to separate the VCC branches . . . . . . . . . . . . . . . . . . . . . . 20

Figure 29.

Path between VCC and ground pin minimized in order to avoid inductive paths . . . . . . . . 20

Figure 30.

Large ground planes on the top and bottom sides of the PCB . . . . . . . . . . . . . . . . . . . . . . 21

Figure 31.

PLL filter soldered as close as possible to the FILT pin . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Figure 32.

Symmetrical paths created for output stage (for differential applications) . . . . . . . . . . . . . 22

Figure 33.

Coils separated in order to avoid crosstalk . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Figure 34.

VCC filter for high frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Figure 35.

Decoupling capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Figure 36.

Snubber filter for spike high frequency in PWM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Figure 37.

Correct common-mode and differential snubber placement . . . . . . . . . . . . . . . . . . . . . . . . 24

Figure 38.

Correct output routing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Figure 39.

Comparison of output routing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Figure 40.

Thermal layout with large ground (1/3 for top and bottom layers) . . . . . . . . . . . . . . . . . . . 26

Figure 41.

Thermal layout with large ground (2/3 for thermal and soldering holes). . . . . . . . . . . . . . . 26

Figure 42.

Comparison of thermal layout (top layer) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Figure 43.

Comparison of thermal layout (bottom layer) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

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