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TN1200 数据表(PDF) 5 Page - STMicroelectronics

部件名 TN1200
功能描述  package description and recommendations for use
PDF  16 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

TN1200 数据表(HTML) 5 Page - STMicroelectronics

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TN1200
Packing specifications and labeling description
16
The cavities in the carrier tape have been designed to avoid any damage to the
components. Specific hole is present to improve device stability during sealing and pick up.
The embossed carrier tape is in a black conductive material (surface resistivity within 10E5
and 10E11 ohm/sq). Use of this material protects the component against damage from
electrostatic discharge and ensures the total discharge of the component prior to placement
on the PCB. Conductivity is guaranteed to be constant and not affected by shelf life or
humidity. The material will not break when bent and does not have any residue to rub off,
powder, or flake.
3.2
Cover tape
The carrier tape is sealed with a transparent, antistatic (surface resistivity within 10E5 and
10E11 ohm/sq) polyester film cover tape with a heat activated adhesive. The cover tape
tensile strength is higher than 10 N.
The peeling force of the cover tape is between 0.08 N and 0.5 N in accordance with the
testing method EIA-481-D and IEC 60286-3. Cover tape is peeled back in the direction
opposite to the carrier tape travel; the angle between the cover tape and the carrier tape is
between 165 and 180 degrees and the test is done at a speed of 120 ±10% mm/minute.
3.3
Reels
The sealed carrier tape with the Flip Chip is reeled on seven-inch reels (see Figure 5 for reel
mechanical dimensions). These reels are compliant with EIA-481-D standard. In particular,
they are made of an antistatic polystyrene material. Color of the reel may vary depending on
supplier.
Dice quantity per reel is 10000 (with typical package thickness equal to 380 µm). In
compliance with the IEC 60286-3, each reel contains a maximum of 0.1% empty cavities.
Two successive empty cavities are not allowed. Each reel may contain components coming
from 2 different wafer lots.
Each reel has a minimum leader of 400 mm and a minimum trailer of 160 mm (compliant
with EIA 481-D and IEC 60286-3 standards). The leader makes up a portion of carrier tape
with empty cavities and sealed by cover tape at the beginning of the reel (external side). The
leader is affixed to the last turn of the carrier tape by using adhesive tape. The trailer is at
the end of the reel and consists of empty, sealed cavities (see Figure 6).
Table 1. Tape cavity sizing
Dimension
Die with both sides
smaller than or equal to 1.5 mm
Die with one side larger than 1.5 mm
A0 and B0
Die side size + 100 µm
Cavity dimensions established to ensure that
component rotation cannot exceed 10° max.



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