HMIC Silicon PIN Diode SP3T Switch with Integrated Bias Network

2 - 18 GHz

Rev. V1

MASW-011053

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M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macomtech.com for additional data sheets and product information.

• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

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7. Unless otherwise specified, all dimensions shown as µm, with tolerance ±5 µm.

8. Die thickness is 125 +10 µm.

9. Topside and backside metallization is gold, 2.5 µm thick typical.

Wire Bonding:

Thermosonic wedge wire bonding using 0.00025” x 0.003” ribbon or 0.001” diameter gold wire is

energy should be adjusted to the minimum required to achieve a good bond. RF bond wires should be kept as

short and straight as possible.

Mounting

The HMIC switches have Ti-Pt-Au back metal. They can be die mounted with a gold-tin eutectic solder

preform or conductive epoxy. Mounting surface must be clean and flat.

Eutectic Die Attachment:

seconds should be required for attachment. Solders containing tin should not be used.

Epoxy Die Attachment:

A minimum amount of epoxy should be used. A thin epoxy fillet should be visible around the perimeter of the

Wire/Ribbon and Die Attachment Recommendations