DICE/DWF SPECIFICATION

2

RH1498

Linear Technology Corporation

1630 McCarthy Blvd., Milpitas, CA 95035-7417

© LINEAR TECHNOLOGY CORPORATION 2006

I.D.No. 66-13-1498 • LT 0110 REV B • PRINTED IN USA

Wafer level testing is performed per the indicated specifications for dice. Considerable differences in performance can often be observed for dice versus

packaged units due to the influences of packaging and assembly on certain devices and/or parameters. Please consult factory for more information

on dice performance and lot qualifications via lot sampling test procedures.

Dice data sheet subject to change. Please consult factory for current revision in production.

otherwise noted.

Note 1: Matching parameters are the difference between amplifiers A

and B.

SYMBOL

PARAMETER

CONDITIONS

MIN

MAX

UNITS

Output Voltage Swing (High)

(Note 2)

No Load

10

150

800

mV

mV

mV

Short-Circuit Current

±15

mA

Supply Current per Amplifier

2.5

mA

GBW

Gain-Bandwidth Product

f = 100kHz

6.8

MHz

SR

Slew Rate

3.5

V/μs

SYMBOL

PARAMETER

CONDITIONS

MIN

MAX

UNITS

Input Offset Voltage

800

μV

Input Offset Voltage Match (Channel-to-Channel)

(Note 1)

1400

μV

Input Bias Current

0

–650

650

0

nA

nA

Input Bias Current Match (Channel-to-Channel)

(Note 1)

0

180

nA

Input Offset Current

65

nA

Large-Signal Voltage Gain

600

V/mV

CMRR

Common Mode Rejection Ratio

76

dB

CMRR Match (Channel-to-Channel) (Note 1)

75

dB

PSRR

Power Supply Rejection Ratio

88

dB

PSRR Match (Channel-to-Channel) (Note 1)

82

dB

Output Voltage Swing (Low)

(Note 2)

No Load

30

100

200

mV

mV

mV

Output Voltage Swing (High)

(Note 2)

No Load

10

150

250

mV

mV

mV

Short-Circuit Current

±12

mA

Supply Current per Amplifier

2.2

mA

unless otherwise noted.

Note 2: Output voltage swings are measured between the output and

power supply rails.