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AN3108 数据表(PDF) 9 Page - STMicroelectronics |
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AN3108 数据表(HTML) 9 Page - STMicroelectronics |
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9 / 44 page ![]() AN3108 STLM75 library Doc ID 16793 Rev 1 9/44 user should change this type mapping in order to reuse this STLM75 library with other microcontrollers ● The source sub-folder contains the firmware library source files. They don't need to be modified by the user: – TempSensorObj.c: API layer file; this contains the exported public API (Application Programming Interface) and the related private internal functions. No direct reference to the Hardware and Micro firmware library occur in this file. – TempSensorHal.c: HAL layer file; this contains all the temperature sensor functions implementation whose source code depends on the MCU used (STM32 for this delivery). The final user should change these file in order to reuse this STLM75 library with other microcontrollers – The STM32_Include sub-folder contains the STM32F10xxxV2.0.3 firmware library included files. If the final user wants to use another microcontroller library version, replace this folder and check the HAL types and the microcontroller library function calls inside the HAL layer files (TempSensorHal.h, TempSensorHalTypes.h, TempSensorHal.c) ● EWARMv5 sub-folder contains the IAR EWARM 5.20 workspace and project files: – STLM75_Lib.eww: The IAR workspace file – STLM75_Lib.ewp: The IAR project file Figure 3. Firmware library project files 3.3 Library architecture The library architecture is devised and developed in two separate layers: ● API layer ● HAL layer This layer architecture improves the code reusability splitting the application programming interface code (fully portable and reusable) from the hardware abstraction layer code (hardware dependent and written onto the STM32F10xxx libraries). 3.3.1 API layer The application programming interface layer allows the final application to use the library as a black-box. The library firmware encapsulation feature and exported API allow full control of |
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