12

µPD4721

RECOMMENDED SOLDERING CONDITIONS

The following conditions (See table below) must be met when soldering this product.

Please consult with our sales offices in case other soldering process is used, or in case soldering is done

under different conditions.

TYPES OF SURFACE MOUNT DEVICE

For more details, refer to our document “SMT MANUAL” (C10535E).

µPD4721 GS-GJG

Soldering process

Soldering conditions

Symbol

Peak package’s surface temperature: 230

°C or below,

Infrared ray reflow

Reflow time: 30 seconds or below (210

°C or higher),

IR30-00-2

Number of reflow process: 2, Exposure limit*: None

Peak package’s surface temperature: 215

°C or below,

Reflow time: 40 seconds or below (200

°C or higher),

VPS

Number of reflow process: 2,

VP15-00-2

Exposure limit*: None

Solder Temperature: 260

°C or lower,

Reflow time: Within 10 sec,

Wave soldering

Number of reflowprocess: 1,

WS60-00-1

Exposure limit*: None

Terminal temperature: 300

°C or below,

Partial heating method

Flow time: 10 seconds or below,

Exposure limit*: None

*

Exposure limit before soldering after dry-pack package is opened.

Storage conditions: 25

°C and relative humidity at 65 % or less.

Note

Do not apply more than a single process at once, except for “Partial heating method”