Doc ID 022904 Rev 1

3/6

Figure 4.

package can be mounted above the standoff to avoid stress between the leads and package

body when TO-220FP is used, therefore improving reliability.

●

Low profile package with enhanced creepage

●

Fully molded, isolated, cost effective and reliable package

●

Body height shorter by 30% compared to the TO-220FP package

●

Same thermal resistance as TO-220FP and heatsink mountable

●

Clip can be used to mount the package which results in more uniform contact pressure

and good thermal contact.

Case (upper)

Case (bottom)

Clip

I2PAKFP (TO-281)

Heatsink

PCB

Mylar Film (bottom)

Mylar Film (upper

)

2.0mm

1.0mm

2.0mm

3.0mm

1.0mm

0.4mm

0.4mm

25.4mm

I2PAKFP (TO-281)

Body + Standoff

height <14.1mm

can be insert above

standoff

PCB

Clip

I2PAKFP (TO-281)

Max 15.6 mm

(need more

allowance due to

others materials

tolerance)

AM12601V1