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DICE SPECIFICATION

RH07

rh07 LT/LT 1099 50 • PRINTED IN USA

© LINEAR TECHNOLOGY CORPORATION 1999

Wafer level testing is performed per the indicated specifications for dice. Considerable differences in performance can often be observed for dice versus

packaged units due to the influences of packaging and assembly on certain devices and/or parameters. Please consult factory for more information on

dice performance and lot qualifications via lot sampling test procedures.

Dice data sheet subject to change. Please consult factory for current revision in production.

Linear Technology Corporation

1630 McCarthy Blvd., Milpitas, CA 95035-7417

Rad Hard die require special handling as compared to standard IC

chips.

Rad Hard die are susceptible to surface damage because there is no

silicon nitride passivation as on standard die. Silicon nitride protects

the die surface from scratches by its hard and dense properties. The

passivation on Rad Hard die is silicon dioxide that is much “softer”

than silicon nitride.

LTC recommends that die handling be performed with extreme care so

as to protect the die surface from scratches. If the need arises to move

the die around from the chip tray, use a Teflon-tipped vacuum wand.

This wand can be made by pushing a small diameter Teflon tubing

onto the tip of a steel-tipped wand. The inside diameter of the Teflon

tip should match the die size for efficient pickup. The tip of the Teflon

should be cut square and flat to ensure good vacuum to die surface.

Ensure the Teflon tip remains clean from debris by inspecting under

stereoscope.

During die attach, care must be exercised to ensure no tweezers touch

the top of the die.

I.D.No. 66-02-0007