AN4016

Layout, parts list, and design considerations

Doc ID 022523 Rev 1

9/17

Figure 5.

Input PCB, and top and bottom view

Rtjc = 0.075 K / W (with T = 1 msec pulsed RF/Duty = 10%), so that, in combination with a

suitable heatsink (heatsink @ Rca <0.2 K / W max.), it permits the junction temperature to

be lower than the rating (Tjmax = 200 degC): in fact, considering a 60% efficiency @ 2200

W, a DeltaTjc = 56 ° C, and DeltaTca <15 ° C, a Tj=95 ° C max. junction temperature can be

expected.

reduce board dimension and external heatsinks; so that, using the flangeless package

STAC 244F (see Figure 6), you can design a new board with the same electrical

characteristics but with a dimension target of 80 x 100 mm.

Figure 6.

STAC244B

AM10222V1