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TN1163 数据表(PDF) 13 Page - STMicroelectronics

部件名 TN1163
功能描述  Description of WLCSP for microcontrollers and recommendations for use
PDF  21 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

TN1163 数据表(HTML) 13 Page - STMicroelectronics

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TN1163
Packing specifications and labelling description
20
3.4
Final packing
Each reel is heat-sealed under inert atmosphere in a transparent recyclable antistatic
polyethylene bag (minimum of 4 mils material thickness). Reels are then packed in
cardboard boxes. A full description of the packing process is shown in Figure 6.
Figure 6. Packing process
3.5
Labelling
To trace each production lot and shipment lot, the 7 inch reels and the cardboard box are
identified by labels that mention the device part number, the shipped quantity and
traceability information.
The trace code printed on the labels ensures backward traceability from the lot received by
the customer to each step of the process. It includes in/ out dates, as well as quantities
during diffusion, assembly, test phase, and in the final storage. Likewise, forward traceability
is able to trace a lot history from the wafer fab to the customer location.
3.6
Storage and shipping recommendations
WLCSP reels are packed under inert N2 atmosphere in a sealed bag. For shipment and
handling, reels are packed in a cardboard box.
ST consequently recommends the following shipping and storage conditions:
•
Relative humidity between 15 and 70 %
•
Temperature ranging from -55 to +150 °C.
•
Components in a non opened sealed bag can be stored for 6 months after shipment.
•
Components in tape and reel must be protected from exposure to direct sunlight.
Note:
Moisture sensitivity level (MSL as per JEDEC J-STD-020) is not applicable to WLCSP
devices since there is no plastic encapsulation.



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