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TN1201 数据表(PDF) 5 Page - STMicroelectronics |
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TN1201 数据表(HTML) 5 Page - STMicroelectronics |
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5 / 13 page ![]() DocID027299 Rev 1 5/13 TN1201 Hardware migration 12 2 Hardware migration The STM32L15/6xxD and STM32L15/6xVD-X devices are produced in the same packages and are pin-to-pin compatible except for WLCSP packages. All common peripherals share the same pins. The FSMC and SDIO and OPAMP3 peripherals are not present in STM32L15/6xVD-X devices. In case FSMC or SDIO or the OPAMP3 were used in STM32L15/6xxD and are no longer needed in the STM32L15/6xVD-X-based new design, some hardware changes are needed when migrating from STM32L15/6xxD to STM32L15/6xVD-X devices. In case FSMC or SDIO or OPAMP3 peripheral were not used in STM32L15/6xxD hardware design, the transition from the STM32L15/6xxD device to the STM32L15/6xVD-X device is simple. The device can be replaced without any hardware change on the application PCB (except for WLCSP). In case of moving from WLCSP64 to WLCSP104 there is of course a hardware redesign needed. |
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