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TN1208 数据表(PDF) 9 Page - STMicroelectronics

部件名 TN1208
功能描述  Tape and reel shipping media for STM8 and STM32 microcontrollers in TSSOP and SSOP packages
PDF  13 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

TN1208 数据表(HTML) 9 Page - STMicroelectronics

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TN1208
Carrier tape mechanical dimensions
12
5
Carrier tape mechanical dimensions
The width is 16 mm (refer to Table 1: TSSOP and SSOP packages available in tape and reel
packing).
Figure 5. Embossed carrier tape
Table 3. Carrier tape constant dimensions
Tape
width
D0
D1 min
E1
P0
P2
R(1)
S1
T max. T1 max.
Unit
16 mm
1.5+0.1
/-0.0
1.5
1.75±0.1
4.0±0.1
2.0±0.1
30
0.6
0.6
0.1
mm
1. The maximum radius the tape with or without components can bend without damage is specified in Section 6: Bending
radius requirements.
Table 4. Carrier tape variable dimensions
Tape
width
B1
E2
F
P1
T2 max.
W max.
A0, B0, K0
Unit
16 mm
12.1
14.25
7.5±0.1
4.0±0.1 to
12.0±0.1 by 4.0
increments
8.0
16.3
See (1)
mm
1. The cavity defined by A0, B0 and K0 surrounds the component with sufficient clearance so that:
- The component does not protrude above the top surface of the carrier tape.
- The component can be removed vertically from the cavity without mechanical restriction, after the top cover tape has been
removed.
- Rotation of the component is limited to 20° maximum for 12 mm tapes and to 10° maximum for 16 mm and 24mm tapes.
- Lateral movements of the component are restricted to 0.5 mm maximum for 12 mm tapes and to 1.0 mm maximum for
16 mm and 24 mm tapes.



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