CREAT BY ART

- Glass passivated chip junction

- Ideal for automated placement

- Low forward voltage drop

- High surge current capability

- Halogen-free according to IEC 61249-2-21 definition

Molding compound, UL flammability classification rating 94V-0

Base P/N with suffix "G" on packing code - green compound (halogen-free)

Base P/N with prefix "H" on packing code - AEC-Q101 qualified

Terminal:

Matte tin plated leads, solderable per JESD22-B102

Meet JESD 201 class 1A whisker test

with prefix "H" on packing code meet JESD 201 class 2 whisker test

50

100

200

400

600

800

1000

V

35

70

140

280

420

560

700

V

50

100

200

400

600

800

1000

V

A

Trr

μs

Cj

pF

Document Number: DS_D1405060

Version: H14

- 55 to +150

Taiwan Semiconductor

1.15

10

250

Typical junction capacitance (Note 3)

40

Operating junction temperature range

Storage temperature range

- 55 to +150

Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C.

Typical reverse recovery time (Note 2)

1.5

Note 1: Pulse test with PW=300μs, 1% duty cycle

Typical thermal resistance

10

V

μA

Maximum instantaneous forward voltage (Note 1)

@ 3 A

Maximum average forward rectified current

3

Peak forward surge current, 8.3 ms single half sine-wave

superimposed on rated load

80

A

Maximum repetitive peak reverse voltage

Maximum RMS voltage

Maximum DC blocking voltage

PARAMETER

SYMBOL

S3

AB

S3

BB

Case:

DO-214AA (SMB)

DO-214AA (SMB)

Polarity:

Indicated by cathode band

Weight:

0.09 g (approximately)

S3

MB

Unit

S3AB thru S3MB

Surface Mount Rectifiers

FEATURES

- Moisture sensitivity level: level 1, per J-STD-020

S3

DB

S3

GB

S3

JB

S3

KB

- Compliant to RoHS Directive 2011/65/EU and

in accordance to WEEE 2002/96/EC

MECHANICAL DATA