05.11.2012

LED740-series

7 of 7

Precaution for Use

1.

Cautions

•

DO NOT look directly into the emitting area of the LED or through the optical system during operation!

To prevent in adequate exposure of the radiation, wear protective glasses.

•

This LED is emitting invisible light.

2.

Lead Forming

•

Lead forming should be done before soldering.

•

When forming leads, the leads should be bent at a point at

least 3 mm from the base of the lead. DO NOT use the base of

the lead frame as a fulcrum during lead forming!

•

DO NOT apply any bending stress to the base of the lead. The

stress to the base may damage the LED’s characteristics or it

may break the LEDs.

•

When mounted the LEDs onto the printed circuit board, the

holes on the circuit board should be exactly aligned with the

leads of LEDs. If the LEDs are mounted with stress at the

leads, it causes deterioration of the lead and it will degrade the

LEDs.

Recommended Land Layout

(Unit: mm)

3.

Soldering Conditions

•

Solder the LEDs no closer than 3 mm from the base of the

lead.

•

DO NOT apply any stress to the lead particularly when heat.

•

After soldering the LEDs, the lead should be protected from

mechanical shock or vibration until the LEDs return to room

temperature.

•

The LEDs must not be reposition after soldering.

•

When it is necessary to clamp the LEDs to prevent soldering

failure, it is important to minimize the mechanical stress on the

LEDs.

•

Cut the LED leads at room temperature. Cutting the leads at

high temperature may cause the failure of the LEDs.

Soldering Conditions

4.

Static Electricity

•

The LEDs are very sensitive to Static Electricity and surge

voltage. So it is recommended that a wrist band and/or an anti-

electrostatic glove be used when handling the LEDs.

•

All devices, equipment and machinery must be grounded

properly. It is recommended that precautions should be taken

against surge voltage to the equipment that mounts the LEDs.