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ZTX751STZ 数据表(PDF) 2 Page - Diodes Incorporated

部件名 ZTX751STZ
功能描述  60V PNP MEDIUM POWER TRANSISTOR IN E-LINE
PDF  7 Pages
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制造商  DIODES [Diodes Incorporated]
网页  http://www.diodes.com
标志 DIODES - Diodes Incorporated

ZTX751STZ 数据表(HTML) 2 Page - Diodes Incorporated

  ZTX751STZ Datasheet HTML 1Page - Diodes Incorporated ZTX751STZ Datasheet HTML 2Page - Diodes Incorporated ZTX751STZ Datasheet HTML 3Page - Diodes Incorporated ZTX751STZ Datasheet HTML 4Page - Diodes Incorporated ZTX751STZ Datasheet HTML 5Page - Diodes Incorporated ZTX751STZ Datasheet HTML 6Page - Diodes Incorporated ZTX751STZ Datasheet HTML 7Page - Diodes Incorporated  
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ZTX751
Document number: DS36459 Rev. 3 - 2
2 of 7
www.diodes.com
July 2013
© Diodes Incorporated
ZTX751
A Product Line of
Diodes Incorporated
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Collector-Base Voltage
VCBO
-80
V
Collector-Emitter Voltage
VCEO
-60
V
Emitter-Base Voltage
VEBO
-7
V
Continuous Collector Current
IC
-2
A
Peak Pulse Current
ICM
-6
A
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Power Dissipation (Note 6)
PD
1.5
W
Power Dissipation (Note 7)
PD
1
W
Thermal Resistance Junction to Ambient (Note 6)
RθJA
116
C/W
Thermal Resistance Junction to Ambient (Note 7)
RθJA
175
C/W
Thermal Resistance Junction to Lead (Note 8)
RθJL
70
C/W
Operating and Storage Temperature Range
TJ, TSTG
-55 to +200
C
ESD Ratings (Note 9)
Characteristic
Symbol
Value
Unit
JEDEC Class
Electrostatic Discharge - Human Body Model
ESD HBM
 4,000
V
3A
Electrostatic Discharge - Machine Model
ESD MM
 400
V
C
Notes:
6. For a through-hole device mounted at the seating plane (2.5mm lead length) with the collector lead on 25mm x 25mm 1oz copper
that is on a single-sided FR4 PCB; device is measured under still air conditions whilst operating in a steady-state.
7. Same as note (5), except the device is mounted on minimum recommended pad layout with 12mm lead length from the bottom of package to the board.
8. Thermal resistance from junction to solder-point at the seating plane (2.5mm from the bottom of package along the collector lead).
9. Refer to JEDEC specification JESD22-A114 and JESD22-A115.



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