BondPad Dimensions

Inches (mm)

RF:0.004 x 0.004

(0.100 x 0.100)

RF1, RF2:0.009 x 0.009

(0.225 x 0.225)

A1, A2, B1, B2:0.004 x 0.004

(0.100 x 0.100)

GND1, GND2:0.009 x 0.004

(0.225 x 0.105)

RL1, RL2:0.004 x 0.005

(0.100 x 0.125)

Handling Precautions

Permanent damage to the MASW2000 may occur if the following

precautions are not adhered to:

A. Cleanliness — The MASW2000 should be handled in a clean

environment. DO NOT attempt to clean unit after the

MASW2000 is installed.

B. Static Sensitivity — All chip handling equipment and personnel

should be DC grounded.

C. Transient — Avoid instrument and power supply transients

while bias is applied to the MASW2000. Use shielded signal

and bias cables to minimize inductive pick-up.

D. Bias —Apply voltage to either control port A1/B2 or A2/B1

only when the other is grounded. Neither port should be

allowed to ”float”.

E. General Handling — It is recommended that the MASW2000

chip be handled along the long side of the die with a sharp

pair of bent tweezers. DO NOT touch the surface of the chip

with fingers or tweezers.

Mounting

The MASW2000 is back-metallized with Pd/Ni/Au (100/1,000/

10,000Å) metallization. It can be die-mounted with AuSn eutectic

preforms or with thermally conductive epoxy. The package sur-

face should be clean and flat before attachment.

Eutectic Die Attach:

A. A 80/20 gold/tin preform is recommended with a work surface

temperature of approximately 255°C and a tool temperature of

265°C. When hot 90/10 nitrogen/hydrogen gas is applied, tool

tip temperature should be approximately 290°C.

B. DO NOT expose the MASW2000 to a temperature greater

than 320°C for more than 20 seconds. No more than 3

seconds of scrubbing should be required for attachment.

Epoxy Die Attach:

A. Apply a minimum amount of epoxy and place the MASW2000

into position. A thin epoxy fillet should be visible around the

perimeter of the chip.

B. Cure epoxy per manufacturer’s recommended schedule.

C. Electrically conductive epoxy may be used but is not required.

Wire Bonding

A. Ball or wedge bond with 1.0 mil diameter pure gold wire.

Thermosonic wirebonding with a nominal stage temperature

of 150°C and a ball bonding force of 40 to 50 grams or wedge

bonding force of 18 to 22 grams is recommended. Ultrasonic

energy and time should be adjusted to the minimum levels to

achieve reliable wirebonds.

B. Wirebonds should be started on the chip and terminated on

the package. GND bonds should be as short as possible; at

least three and no more than four bond wires from ground

pads to package are recommended.

Handling, Mounting, Bonding Procedure

MASW2000

Truth Table***

Control Inputs

Condition Of Switch

A1/B2

A2/B1

RF1

RF2

On

Off

Off

On

*** For normal SPDT operation A1 is connected to B2 and A2 is connected to B1.

Maximum Ratings

A.Control Voltage (A1/B2 or A2/B1):-8.5 Vdc

B. Max Input RF Power: +34 dBm

C. Storage Temperature:-65°C to +175°C

D. Maximum Operating Temperature:+175°C

Die Size

Inches (mm)

0.056 x 0.056 x 0.010

(1.40 x 1.40 x 0.25)

V 2.00